Automatic Solder Paste Printer for Industrial 4.0 MES System
Introduction
The Automatic Solder Paste Printing Machine represents top-tier
equipment tailored for sophisticated SMT applications. It
skillfully tackles the demanding printing needs of 03015 components
and 0.25 pitch, ensuring unparalleled accuracy and swift
performance.
Specification
| Model | G9+ |
| Max PCB Size | 450x340mm |
| Min PCB size | 50x50mm |
| PCB thickness | 0.4-6mm |
| Max board weight | 5kg |
| Transport height | 900±40mm |
| Board edge gap | 2.5mm |
| Board height | 15mm |
| Transport direction | L-R,R-L |
| Transport speed | max 1500mm/s, program control |
| Transport method | One stage |
| WIdth adjustment | automatic |
| I/O interface | SMEMA |
| PCB positioning (support method) | Magnetic pin/support block/manual up-down table |
| PCB clamping system | Patented over the top clamping |
| Side clamping |
| Adsorption function |
| Print snap-off | 0-20mm |
Print mode | one/twice |
Print Speed | 10-200mm/sec |
Print Mode | One /Twice |
Squeegee Type | Rubber /steel Squeegee Blade(Angle 45°/55°/60°) |
| Print pressure | 0.5-10kg |
| Template fram size | 470*370mm~737*737mm(20-40thickness) |
Cleaning System | Droops of rain type cleaning system |
| Reinforced vacuum absorption |
| Dry, wet vacuum three modes |
| Back and forth cleaning |
CCD FOV | 10x8mm |
| Fiducial mark types | Standard Fiducial mark shape |
| Pad |
| Hole |
| Camera system | Look up/down optics structure |
| CCD digital camera |
| Geometry pattern match |
Machine Performance
| Model | G9+ |
| Repeat position accuracy | ±12.5um@6,CPK≥2.0 |
| Print accuracy | ±18um@6,CPK≥2.0 |
| Print cycle time | ＜7.5 sec |
| Based on the third party test system(CTQ) verify the actual solder
paste printing position repeat precision |
Whole Machine Specification
Power supply | AC:220±10%,50/60HZ, 3.0KW |
Air pressure | 4~6 kgf/cm² |
Air consumption | around 5L/min |
Operating temperature | -20℃~+45℃ |
Operating humidity | 30%~60% |
Machine Dimensions(without tower light) | 1172(L) x 1385(W) x 1530 (H)mm |
Machine Weight | Approx: around 1000Kg |
Features
This cutting-edge system incorporates an innovative optical path
that delivers uniform circular illumination and bright coaxial
lighting. Dual light sources provide infinite brightness
adjustment, facilitating easy recognition of diverse and uneven
mark points on various surfaces, including tin-plated,
copper-plated, silver-plated materials, hot air-soldered items,
FPC, and different PCB colors.
High-Precision PCB Thickness Adjustment Mechanism:
This mechanism features a robust structure with stable XY movement,
enabling manual adjustment to seamlessly accommodate a broad range
of PCB thicknesses.
Revolutionary Guide Rail Positioning System:
Designed to address FPC and PCB warpage, this system includes a
detachable pattern guide rail and a programmable flexible side
clamp. A unique clamping plate device ensures precise positioning,
while software programming automates stretching and retraction to
adapt to varying PCB thicknesses with ease.
Enhanced Squeegee Structure:
The squeegee structure boasts a comprehensive design that
significantly improves stability and extends its lifespan.
Advanced High-Speed Stencil Cleaning Mechanism:
The downward dispensing cleaning structure effectively prevents
stencil opening clogging, a prevalent issue in stencil cleaning
processes. Software control allows for simple adjustment of the
solvent dispensed length to achieve optimal cleaning results.
User-Friendly Multi-Function Interface:
Designed for simplicity and clarity, this intuitive interface
offers real-time temperature and humidity monitoring, enabling
users to effortlessly monitor and adjust conditions as needed.
About Us
Shenzhen HanSome Technology Co., Ltd. (HSTECH), founded in 2012, is
led by a highly experienced engineer with a deep background in the
EMS industry. Since its beginning, the company has specialized in
developing and manufacturing PCB processing equipment, gradually
expanding its portfolio to include PCB strippers and SMT cleaning
machines. HSTECH is proud to have a skilled and ambitious R&D
team that is constantly on the lookout for the latest industry
technologies. This team is supported by a seasoned marketing group
with a strong focus on exports, enabling HSTECH to stay ahead of
market trends and ensure its products meet evolving customer needs.
Throughout its history, HSTECH has adhered to the principle of
innovative development, achieving significant technological and
product advancements. Our goal is to provide cost-effective
solutions that empower our customers to increase productivity while
minimizing costs and labor. We stand in solidarity with our
customers, working together to create a brighter future.
HSTECH is committed to achieving "High Quality and Smartness,"
aligning with our "Quality-Oriented and Customer-Centric"
philosophy. We incorporate industry-specific features and pursue
smart technology to bring the vision of smart factories to life. In
terms of after-sales service, we uphold the principle of
"Responsibility," promptly addressing any quality feedback and
consistently delivering exceptional service to our valued
customers.
