Precision Solder Paste Machine for Industrial 4.0 MES System
Compatibility
Introduction
The G9+ Fully Automatic Solder Paste Printer is a high-end machine
for SMT high end applications and fulfils the requirements of
03015, 0.25 pitch, high precision and high speed printing
processes.
Specification
| Model | G9+ |
| Max PCB Size | 450x340mm |
| Min PCB size | 50x50mm |
| PCB thickness | 0.4-6mm |
| Max board weight | 5kg |
| Transport height | 900±40mm |
| Board edge gap | 2.5mm |
| Board height | 15mm |
| Transport direction | L-R,R-L |
| Transport speed | max 1500mm/s, program control |
| Transport method | One stage |
| WIdth adjustment | automatic |
| I/O interface | SMEMA |
| PCB positioning (support method) | Magnetic pin/support block/manual up-down table |
| PCB clamping system | Patented over the top clamping |
| Side clamping |
| Adsorption function |
| Print snap-off | 0-20mm |
Print mode | one/twice |
Print Speed | 10-200mm/sec |
Print Mode | One /Twice |
Squeegee Type | Rubber /steel Squeegee Blade(Angle 45°/55°/60°) |
| Print pressure | 0.5-10kg |
| Template fram size | 470*370mm~737*737mm(20-40thickness) |
Cleaning System | Droops of rain type cleaning system |
| Reinforced vacuum absorption |
| Dry, wet vacuum three modes |
| Back and forth cleaning |
CCD FOV | 10x8mm |
| Fiducial mark types | Standard Fiducial mark shape |
| Pad |
| Hole |
| Camera system | Look up/down optics structure |
| CCD digital camera |
| Geometry pattern match |
Machine Performance
| Model | G9+ |
| Repeat position accuracy | ±12.5um@6,CPK≥2.0 |
| Print accuracy | ±18um@6,CPK≥2.0 |
| Print cycle time | ＜7.5 sec |
| Based on the third party test system(CTQ) verify the actual solder
paste printing position repeat precision |
Whole Machine Specification
Power supply | AC:220±10%,50/60HZ, 3.0KW |
Air pressure | 4~6 kgf/cm² |
Air consumption | around 5L/min |
Operating temperature | -20℃~+45℃ |
Operating humidity | 30%~60% |
Machine Dimensions(without tower light) | 1172(L) x 1385(W) x 1530 (H)mm |
Machine Weight | Approx: around 1000Kg |
Features
1.CCD digital system, new all-optical system, uniform ring light
and high brightness coaxial light source. Adopting double light
source system, the brightness can be adjusted by stepless loop,
which can easily identify different solder joints (including uneven
solder joints), such as tin-plated, copper-plated, silver-plated,
hot-air soldering, FPC, and all kinds of PCBs with different
colours.
2.High precision PCB thickness adjustment, extremely reliable
structure, stable XY movement. Manual adjustment can easily adapt
to different PCB thickness.
3.Guideway positioning system, new pattern guideway disable,
programmable flexible side clamp, for FPC, PCB warping, perform
unique clamping device. Through software programming can
automatically extend and withdraw unaffected PCB board warpage.
4. New innovative scraper structure design with comprehensive
scraper system for improved stability and service life.
5. High-speed stencil cleaning with downward distribution cleaning
structure successfully prevents clogging of openings (which has
been the root cause of poor cleaning results). The length of
solvent distribution can also be easily adjusted through software
control.
6. New multi-functional interface, simple and clear, user-friendly.
Actual temperature and humidity monitoring function.
