Customizable Glue Mixing Ratio Glue Dispensing Machine for Wall
Sphere
Machine feature
1. Manual programming operation, easy to program, easy to learn and
understand.
2. It has the functions of drawing points, lines, faces, arcs,
circles, and continually tween of irregular curves to realize any
3D non-planar track path.
3. The volume of the glue, the speed of the glue, the time of
dispensing, and the time of stopping the glue can all be
programmed.
4. With the special dispensing controller, the glue output is
stable, the glue is clean and the glue is not leaked.
5. Quickly dot, draw lines and draw circles in the inner, outer
wall, vertical surface, gap and spherical surface of the product.
6. According to the needs of customers, it can be equipped with
fixtures, glue guns, controllers, heating temperature control
devices, etc.
Specification
| ITEM | SPEC |
| Glue Mixing Ratio | 1:1-10:1/Customizable |
| Dispensing Speed | 10-150g/5s(based on 1:1 glue proportion) |
| Dispensing Precision | Glue Amount±1%, Glue Proportion±1% |
| X/Y/Z Working Range | 300*300*100mm(Z axis can be rotated) |
| XYZ Speed | Max 300mm/s |
| Drive System | Stepping Motor + Timing Belt |
| Repeatability | ±0.02mm |
| Pattern | Lines, Circles, Arcs, Continuous Paths, 3D Linear Interpolation |
| Potting Precision | Amount±1%, Ratio:±1% |
| Operation Method | Auto |
| Programming | Teach Pendant |
| Control | Board card |
| Leak-proof Function | Valve with Vacuum Device |
| Weight | 65kg |
| Dimension(L*W*H) | 716*585*645mm |
| Power Supply | 220V 50-60Hz 350W |
Applications
This equipment is suitable for high efficiency, high running
precision and production process of dispensing. Generally suitable
for products with sensors, relays, power adapters, electronic toys,
sounders, electronic components, household appliances, electric
vehicle controllers, computer digital products, crafts, mobile
phone boards, coil products, button products,battery boxes,
speakers Dot glue bonding; speaker packaging and dispensing,
optical semiconductor, mobile phone battery, laptop battery
packaging, PCB board bonding, COB, IC, PDA, LCD sealing, IC
packaging, IC bonding, chassis bonding, Optical device processing,
hardware parts package coating, quantitative liquid filling, chip
bonding, automotive mechanical parts coating,mechanical seals, etc.
