High-precision CCD colour alignment system for PCB handling
equipment
Introduction
BGA's full name is BallGridArray, it is in the bottom edge of the
package body substrate to make an array of solder ball as the I/O
end of the circuit and the printed circuit board (PCB)
interconnection.BGA is a class of chip packaging technology, rework
BGA chip machine and equipment is called the BGA rework station its
rework range includes a variety of package chip.BGA is based on the
ball grid array structure to enhance the characteristics of digital
equipment to reduce the size of the product. BGA is based on the
ball grid array structure to enhance the characteristics of digital
devices and reduce the size of the product. All the digital devices
based on this packaging technology have the same characteristics,
that is, small size, strong features, low cost, powerful functions,
BGA rework station is used to repair the BGA chip equipment.
Specification
| Mobile Phone BGA Rework Station | Model:HS-700 |
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Total power | 2600W |
| Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
| Electric material | Driving motor + smart temp. controller + color touch screen |
| Temperature control | high precision K-sensor+ closed loop control + independent
temp.controller (the precision can reach ±1℃) |
| Sensor | 1pcs |
| Locating way | V shape PCB support + external universal fixture + laser light for
centering and positioning |
| Overall dimension | L450mm*W470mm*H670mm |
| PCB size | Max 140mm*160mm Min 5mm*5mm |
| BGA size | Max 50mm*50mm Min 1mm*1mm |
| Applicable PCB thickness | 0.3 - 5mm |
| Mounting accuracy | ±0.01mm |
| Weight of machine | 30KG |
| Mount chip weight | 150g |
| Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
| Usage Repair | chips / phone motherboard etc |
Features
1. 5 work modes
2. 15''HD LCD monitor
3. 7''HD color touch screen
4. stepping motor
5. CCD color optical alignment system
6.Temperature accuracy within ±1℃
7.Mounting precision within ±0.01mm
8.Repair success rate: 99% +
9. Independent research and development of single-chip control
About Packaging
COMPANY PROFILE
Shenzhen Hansome Technology Co.,Ltd(HSTECH)is a professional
professional SMT board handlingequipment(Loader,Unloader, Buffer,
Conveyor,etc)manufacturer, We are a high-tech enterprise with
independent intellectual propertyrights,the company is mainly
engaged in the research and development, productionand sales of
sMT/THT production line board handling equipment.We have
professional technicians & sales,relies on high-tech and tries our
best tosupply high efficient and reliable board handling to our
customers. At the same time,our experienced engineering team always
grasps smart factory's developing directionupdates the products and
technical according to the market demand, pursuit to makemore
automation and cost-effective product all the time, we also do the
OEM basedon different needs of our customer.
