Independent 3 Heating Zones BGA Rework Station PCB Handling
Equipment With SMEMA Signal
Introduce
The BGA rework station is a professional equipment used to repair
BGA components. It is often used in the SMT industry. Next, we will
introduce the basic principles of the BGA rework station and
analyze the key factors to improve the BGA rework rate.
The BGA rework station is a device for reheating and welding poorly
soldered BGAs. It cannot repair the factory quality problems of the
BGA components themselves. However, according to the current level
of technology, the probability of BGA components having problems
before leaving the factory is very low. If there is a problem, it
will only be poor welding caused by temperature at the SMT process
end and the back end, such as empty welding, false welding, empty
welding, tin connection and other welding problems. However, many
individuals also use it when repairing laptops, mobile phones,
XBOX, desktop motherboards, etc.
Features
1.Repair Success Rate:More Than 99%
2.Using The Industrial Touch Screen
3.Independent 3 Heating Zones, Hot Air Heating/ Infrared Preheat.
(temperature accuracy ± 2℃)
4.With CE Certification
BGA rework station classification
Classified by automation level
BGA rework stations can be divided into three categories according
to their functions, namely: purely manual BGA rework stations,
semi-automatic BGA rework stations, and fully automatic BGA rework
stations; the selections corresponding to different needs are also
different. Generally, manual BGA rework stations and semi-automatic
rework stations are suitable for user groups who are not relatively
advanced in rework processes. First of all, the fully automatic BGA
rework station is simple to operate, with almost no requirements on
the operator, and one-button operation. Secondly, the success rate
of repair is higher. More powerful functions.
Divided by function
According to functions, BGA rework stations can be divided into two
categories: optical alignment and non-optical alignment. Optical
alignment uses split prism imaging through the optical module;
non-optical alignment uses the naked eye to align the BGA according
to the silk screen lines and points of the PCB board to achieve
alignment repair. Intelligent operating equipment for visual
alignment, welding, and disassembly of BGA originals of different
sizes can effectively improve the rework rate, productivity, and
greatly reduce costs.
Specification
| Manual BGA Rework Station | Model:HS-520 |
| Power Supply | AC 220V±10% 50/60Hz |
| Total power | 3800W |
| Overall dimension | L460mm*W480mm*H500mm |
| PCB size | Max 300mm*280mm Min 10mm*10mm |
| BGA size | Max 60mm*60mm Min 1mm*1mm |
| PCB thickness | 0.3-5mm |
| Weight of machine | 20KG |
| Warranty | 3 years (1st year is free) |
| Usage Repair | chips / phone motherboard etc |
