GKG SMT Solder Paste Stencil Printing Machine with Drip Cleaning
Function
Introduction
Handling M Size board, GT++ is adept at delivering all your
business needs. It successfully attained 01005 miniature printing.
Through full contact with the stencil, our improved cleaning system
ensures that any remaining paste in the mesh will be eliminated
before printing. The 2D paste inspection function is able to detect
insufficient paste, bridging and other defects. GT++ is also
equipped with top and motorized side clamp, thereby ensuring
superior printing quality.
Specification
| Model | GT++ |
| Max PCB Size | 510x510mm |
| Min PCB size | 50x50mm |
| PCB thickness | 0.4-6mm |
| Max board weight | 5kg |
| Transport height | 900±40mm |
| Board edge gap | 2.5mm |
| Board height | 23mm |
| Transport direction | L-R,R-L |
| Transport speed | max 1500mm/s, program control |
| Transport method | One stage |
| PCB positioning (support method) | Magnetic pin/support block/auto up-down table |
| PCB clamping system | Patented over the top clamping |
| Side clamping |
| Adsorption function |
| Print snap-off | 0-20mm |
Print mode | one/twice |
Print Speed | 10-200mm/sec |
Print Mode | One /Twice |
Squeegee Type | Rubber /steel Squeegee Blade(Angle 45°/55°/60°) |
| Print pressure | 0.5-10kg |
| Template fram size | 470*370mm~737*737mm(20-40thickness) |
Cleaning System | Droops of rain type cleaning system |
| Dry, wet vacuum three modes |
| Back and forth cleaning |
CCD FOV | 10x8mm |
| Fiducial mark types | Standard Fiducial mark shape |
| Pad |
| Hole |
| Camera system | Look up/down optics structure |
| CCD digital camera |
| Geometry pattern match |
Machine Performance
| Model | GT++ |
| Repeat position accuracy | ±12.5um@6,CPK≥2.0 |
| Print accuracy | ±18um@6,CPK≥2.0 |
| Print cycle time | ＜7.5 sec |
| Based on the third party test system(CTQ) verify the actual solder
paste printing position repeat precision |
Whole Machine Specification
Power supply | AC:220±10%,50/60HZ, 3.0KW |
Air pressure | 4~6 kgf/cm² |
Air consumption | around 5L/min |
Operating temperature | -20℃~+45℃ |
Operating humidity | 30%~60% |
Machine Dimensions(without tower light) | 1240(L) x 1410(W) x 1500 (H)mm |
Machine Weight | Approx: around 1100Kg |
Features
1, CCD digital system, total new optical path system, uniform
circular light and high brightness of coaxial light source. With
both light source system, brightness can adjust to an infinite
loop, allowing different mart point can be easily recognize
(including uneven mark point) such as tin plating, copper plating,
silver plating, hot air soldering, FPC and various types of
different PCB color.
2, High precision PCB thickness adjustment, extremely reliable
structure with stable XY movement. Manual adjustment makes it a
breeze to accommodate different PCB thickness.
3,Guide rail positioning system, new Pattern guide rail ban detachable, programmable flexible side
clamp, specific to FPC, PCB warpage, perform a unique clamping
plate device. Through software programming can automatically
stretch out and draw back unaffected PCB pickness.
4, New innovative squeegee structure design, adopt a comprehensive
squeegee system which enhances stability and long lifespan.
5, High speed stencil cleaning, downward dispensing cleaning
structure successfully prevents clogged opening(which is always the
root cause for ineffective cleaning) from taking place. The length
of solvent dispensedcan also be easilyamended with software
control.
6, New multi-function interface, simplicity , clearly understand,
friendly user. Actual temperature and humidity monitor function.
Functions
1.Drip cleaning system
Drip cleaning structure,effectively prevent thesolvent tube
blockagecause no solvent whilecleaning and poor cleaning effect.
2.Total now squeegee blade structure design
Through sliding rail and air cylinder new pattern squeegee
bladestructure, increase movement stability and prolonging the
service life.
