Whole Maunal/Automatic Printer SMT Solder Paste Stencil Printing
Machine for PCBs up to 400x340mm
1.Fully automatic solder paste printing machine achieves accurate
printing positioning through vision system. The system is able to
automatically identify the characteristics of the printing plate
and make precise adjustments according to the preset parameters. It
ensures that the printing position is accurate from the whole.
Compared with manual operation, automatic tin printing machine can
greatly reduce human error and improve the printing quality of
products.
2. Automatic solder paste printing machine has high-speed printing
ability. The equipment adopts advanced mechanical structure and
motion control technology, which can complete the printing task at
a faster speed. High-speed printing not only improves the
production efficiency, but also reduces the production cycle and
increases the production capacity.
3. Automatic solder paste printing machine has automatic operation
function at the same time. In the printing process without human
intervention, the equipment can automatically complete the
printing, calibration and cleaning. This automatic operation not
only reduces the time and cost of manual operation, but also
improves the accuracy and stability of the operation and reduces
the quality problems caused by human factors.
4. Automatic solder paste printing machine also has good
flexibility and adaptability, the equipment can be automatically
adjusted according to different work requirements into points,
suitable for a variety of different sizes, shapes and thicknesses
of the printing plate. This flexibility makes the equipment
suitable for a variety of different types of electronic products.
5. Automatic tin printing machine in the electronics manufacturing
industry plays an important role, through its accurate printing
positioning, high-speed printing capacity, automated operation
functions and flexible adaptability, the equipment improves the
printing quality and production efficiency, for the manufacture of
electronic products to provide a reliable guarantee.
Specification
| Model | GSE |
| Stencil size | 370x370mm(min size) |
| 737x737mm(max size) |
| 20-40mm(thickness) |
| Max PCB Size | 400x340mm |
| Min PCB size | 50x50mm |
| PCB thickness | 0.4-6mm |
| PCB warpage | max 1% PCB diagonal |
| Transport height | 900±40mm |
| Transport direction | L-R,R-L |
| Transport speed | max 1500mm/s, can be adjustment |
| Transport method | One stage |
| WIdth adjustment | automatic |
| I/O interface | SMEMA |
| PCB positioning (support method) | Magnetic pin/support block/up-down table |
| PCB clamping system | Patented over the top clamping/side clamping |
| Print head | Two independent motorised printheads |
Squeegee Pressure | 0.5~10Kg (Program Control) |
Print Speed | 6-200mm/sec |
Print Mode | One /Twice |
Squeegee Type | Rubber /steel Squeegee Blade(Angle 45°/55°/60°) |
Cleaning System | Ireinforced vacuum absorption ,dry ,wet, vacuum three modes |
CCD FOV | 8x6mm |
| Machine adjust range | X: ± 3mm, Y:± 7 mm , θ:± 2° |
| Vision | Look Up/Down Optics Structure/CCD/Geometry Pattern-match |
Whole Machine Specification
Repeat Position Accuracy | ±0.01mm |
Printing Accuracy | ±0.025mm |
Cycle Time | ＜8 Sec |
Product Changeover | old:<3 mins,new:<5 mins |
Air supply | 4~6 kgf/cm |
| Power supply | AC:220±10%,50/60HZ, 2.5KW |
| Control method | PC |
| Operation system | Windows XP/Win7 |
Machine Dimensions | 1158(L) x 1362(W) x 1463 (H)mm |
Machine Weight | Approx: around 1000Kg |
