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Industrial Manual BGA Rework Station Touch Screen 3 Heating Zones With & CE

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    Buy cheap Industrial Manual BGA Rework Station Touch Screen 3 Heating Zones With & CE from wholesalers
     
    Buy cheap Industrial Manual BGA Rework Station Touch Screen 3 Heating Zones With & CE from wholesalers
    • Buy cheap Industrial Manual BGA Rework Station Touch Screen 3 Heating Zones With & CE from wholesalers
    • Buy cheap Industrial Manual BGA Rework Station Touch Screen 3 Heating Zones With & CE from wholesalers

    Industrial Manual BGA Rework Station Touch Screen 3 Heating Zones With & CE

    Ask Lasest Price
    Brand Name : HSTECH
    Model Number : HS-520
    Certification : CE
    Price : Negotiable
    Payment Terms : T/T, Western Union, MoneyGram
    Supply Ability : 100 sets per month
    Delivery Time : 7~9 work days
    • Product Details
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    Industrial Manual BGA Rework Station Touch Screen 3 Heating Zones With & CE

    Industrial Touch Screen 3 Heating Zones Manual BGA Rework Station with & CE


    Introduction:


    A BGA Rework Station is a specialized tool used in the electronics manufacturing industry to repair or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). These components are popular due to their high density and performance but can be challenging to work with when defects occur.


    Features:

    1.Repair Success Rate:More Than 99%

    2.Using The Industrial Touch Screen

    3.Independent 3 Heating Zones, Hot Air Heating/ Infrared Preheat. (temperature accuracy ± 2℃)

    4.With CE Certification.


    ​Specification:


    Manual BGA Rework StationModel:HS-520
    Power SupplyAC 220V±10% 50/60Hz
    Total power3800W
    Overall dimensionL460mm*W480mm*H500mm
    PCB sizeMax 300mm*280mm Min 10mm*10mm
    BGA sizeMax 60mm*60mm Min 1mm*1mm
    PCB thickness0.3-5mm
    Weight of machine20KG
    Warranty3 years (1st year is free)
    Usage Repairchips / phone motherboard etc

    Applications


    BGA Component Replacement:
    Used to remove faulty BGA components and replace them with new ones, essential for repairs and upgrades.
    Solder Joint Repair:
    Facilitates the reflow of solder joints for reworking connections that may have failed or become cold soldered.
    Prototyping:
    Useful in prototyping environments where BGA components need to be frequently replaced or modified.
    Quality Control:
    Employed in quality control processes to inspect and repair PCBs before final assembly or shipment.


    Benefits


    Increased Reliability:
    Enables effective repair of BGA components, extending the life of PCBs and reducing waste.
    Cost-Effective Repairs:
    Reduces the need for complete PCB replacements, saving costs in manufacturing and maintenance.
    Enhanced Precision:
    Provides precise temperature control and alignment for high-quality rework results, ensuring the integrity of the PCB.
    Time Efficiency:
    Streamlined rework processes allow for quicker turnaround times in manufacturing and repair environments.
    Flexibility:
    Can handle various sizes and types of BGA components, making them versatile for different applications.


    3 Heating Zones Manual BGA Rework Station with Industrial Touch Screen & CE 0

    3 Heating Zones Manual BGA Rework Station with Industrial Touch Screen & CE 1


    Quality Industrial Manual BGA Rework Station Touch Screen 3 Heating Zones With & CE for sale
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