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MCGS Touch Screen Control BGA Rework Station Manual & Automatic Laser Position

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    Buy cheap MCGS Touch Screen Control BGA Rework Station Manual & Automatic Laser Position from wholesalers
     
    Buy cheap MCGS Touch Screen Control BGA Rework Station Manual & Automatic Laser Position from wholesalers
    • Buy cheap MCGS Touch Screen Control BGA Rework Station Manual & Automatic Laser Position from wholesalers
    • Buy cheap MCGS Touch Screen Control BGA Rework Station Manual & Automatic Laser Position from wholesalers

    MCGS Touch Screen Control BGA Rework Station Manual & Automatic Laser Position

    Ask Lasest Price
    Brand Name : HSTECH
    Model Number : HS-620
    Certification : CE
    Price : Negotiable
    Payment Terms : T/T, Western Union, MoneyGram
    Supply Ability : 100 sets per month
    Delivery Time : 7~9 work days
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    MCGS Touch Screen Control BGA Rework Station Manual & Automatic Laser Position

    MCGS Touch Screen Control Manual & Automatic Laser Position BGA Rework Station


    Introduction


    A BGA Rework Station is a specialized equipment used in the electronics manufacturing and repair industry to rework or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). BGA components are commonly used due to their high density and performance, but they can be challenging to repair when defects occur.


    Features:

    1.Automatic&Manual operation system.

    2. 5 million CCD camera optical alignment system mount precision:±0.01mm.

    3.MCGS touch screen control.

    4.Laser position.

    5.Repair success rate 99.99%.


    ​Specification:


    BGA Rework StationModel:HS-620
    Power SupplyAC 220V±10% 50/60Hz
    Total power3500W
    Heater powerUpper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W
    Electric materialDriving motor+PLC smart temp.controller+color touch screen
    Temperaturecontrol independent temp.controller,the precision can reach ±1℃
    Temperature Interface1pcs
    Locating wayV shape slot,PCB support jigs can adjust,laser light do fast centering and position
    Overall dimensionL650mm*W630mm*H850mm
    PCB sizeMax 450mm*390mm Min 10mm*10mm
    BGA sizeMax 80mm*80mm Min 1mm*1mm
    Weight of machine60KG
    Usage Repairchips / phone motherboard etc

    Applications


    BGA Component Replacement:
    Used to remove faulty BGA components and replace them with new ones, essential for repairs and upgrades.
    Solder Joint Repair:
    Facilitates the reflow of solder joints for reworking connections that may have failed or become cold soldered.
    Prototyping:
    Useful in prototyping environments where BGA components need to be frequently replaced or modified.
    Quality Control:
    Employed in quality control processes to inspect and repair PCBs before final assembly or shipment.


    Benefits


    Increased Reliability:
    Enables effective repair of BGA components, extending the life of PCBs and reducing waste.
    Cost-Effective Repairs:
    Reduces the need for complete PCB replacements, saving costs in manufacturing and maintenance.
    Enhanced Precision:
    Provides precise temperature control and alignment for high-quality rework results.
    Time Efficiency:
    Streamlined rework processes allow for quicker turnaround times in manufacturing and repair environments.
    Flexibility:
    Can handle various sizes and types of BGA components, making them versatile for different applications.


    Manual & Automatic Laser Position MCGS Touch Screen Control BGA Rework Station 0

    Manual & Automatic Laser Position MCGS Touch Screen Control BGA Rework Station 1

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